陈子健 特聘副教授

邮件地址：zijianchen@shu.edu.cn

个人简介：

主要研究方向为用于柔性电子设备制造的先进图案化方法，结合材料设计制造与微纳加工技术，探索柔性电子设备在传感器、光电器件、生物医学工程等领域的应用。在相关领域累计发表SCI论文13篇，授权专利2项。

欢迎具有材料、化学、微电子、电子信息、生物医学工程等相关专业背景的同学报考硕士研究生。

研究方向：

1.柔性电子图案化方法

2.透气电子皮肤制造

3.面向疾病诊疗的可穿戴/可植入电子设备

4.柔性光电设备制造

5.柔性纳米摩擦发电机制造及应用

教育背景：

2025年博士毕业于香港理工大学时装与纺织学院

2020年硕士毕业于曼彻斯特大学纳米材料专业

2019年本科毕业于中南大学材料科学与工程专业

工作经历：

2026年1月至今，上海大学，特聘副教授

代表性成果：

1.Chen, Z., Lu, X., Wang, H., Chang, J., Wang, D., Wang, W., ... & Zheng, Z. Electrochemical replication and transfer for low‐cost, sub‐100 nm patterning of materials on flexible substrates. Advanced Materials, 2023, 35(10), 2210778.

2.Fu, J., Chen, Z., Xu, G., Zi, Y., …, Huang, Q., Zheng, Z. A Scalable and Cost-effective Approach for Manufacturing Soft and Highly Precise Triboelectric Electronics via Electrochemical Replication and Transfer. ACS Nano, 2025, 19(26), 23539–23551.

3.Chen, Z., Liang, J.,Fu, J., ..., Li, P., Zheng, Z. Electronic Bandage with High-Resolution Interdigital Electrode Enhanced Pulsed Electric Field for Accelerated Wound Healing. EcoMat, 2026.

4.Chen, Z., Zhang, C., Zheng, Z. Advancements in Transfer Printing Techniques for Flexible Electronics: Adjusting Interfaces and Promoting Versatility. International Journal of Extreme Manufacturing, 2024, 6(5), 052005.

5.Chen, Z., Fu, J., Chen, F., Xie, C., Zhuang, Q., Huang, Q., Zheng, Z. Construction of three-dimensional patterns through modified electrochemical replication and transfer. Advanced Materials Technologies, 2024, 9(21), 2301695.

6.Wang, P., Ma, X., Lin, Z., Chen, F., Chen, Z., Hu, H., ... & Zheng, Z. Well-defined in-textile photolithography towards permeable textile electronics. Nature Communications, 2024, 15(1), 887.

7.Chen, F., Zhuang, Q., Ding, Y. Zhang, C., Song, X., Chen, Z., … & Zheng, Z. Wet-Adaptive Electronic Skin. Advanced Materials, 2023, 35(49), 2305630.

8.Hu, H., Guo, X., Zhang, Y., Chen, Z., Wang, L., Gao, Y., ... & Zheng, Z. Elasto-Plastic Design of Ultrathin Interlayer for Enhancing Strain Tolerance of Flexible Electronics. ACS Nano, 2023, 17(4), 3921–3930.